发明名称 |
Physical vapor deposition of titanium nitride on a nonconductive substrate |
摘要 |
A process for physical vapor deposition of a refractory coating such as titanium nitride on a nonconductive substrate such as a ceramic substrate and the coated substrate produced thereby. The nonconductive substrate is coated by cleaning the nonconductive substrate surfaces and then depositing a first layer of a refractory metal such as titanium metal on the nonconductive substrate by physical vapor deposition. A second layer of a refractory compound such as titanium nitride is then deposited on the first layer by physical vapor deposition to produce a coated nonconductive substrate having enhanced coating adhesion.
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申请公布号 |
US5858181(A) |
申请公布日期 |
1999.01.12 |
申请号 |
US19930112013 |
申请日期 |
1993.08.25 |
申请人 |
KENNAMETAL INC. |
发明人 |
JINDAL, PREM C.;QUINTO, DENNIS T. |
分类号 |
C04B35/80;C04B41/52;C04B41/53;C04B41/89;C04B41/91;C23C14/02;C23C14/06;C23C14/18;(IPC1-7):C23C14/34 |
主分类号 |
C04B35/80 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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