发明名称 LEAD TERMINAL FOR SURFACE MOUNTED PARTS
摘要 PROBLEM TO BE SOLVED: To provide a lead terminal for surface mounted parts mitigating a request of planar precision and enhancing soldering precision. SOLUTION: Contraction force according to hardening of solder (cream solder 26) is converted to rotational force, and by bringing the lead terminals 4, 6 close to wiring conductive bodies 22, 24 with its rotational force, the soldering precision between the wiring conductive bodies and the lead terminals is enhanced. That is, the lead terminals of the surface mounted parts are constituted so that an angle is set between a soldering surface of pad 14, 16 of at least one of lead terminals 4, 6 of the surface mounted part (e.g. electroacoustic transducer) and the wiring conductive body surface to be soldered (wiring conductive body 22, 24), and the rotational force in the direction bringing the pad of another lead terminal close to the wiring conductive body surface to be connected is caused by the contraction force according to the hardening of the solder (cream solder 26) set up between the pad and the wiring conductive body surface.
申请公布号 JPH117284(A) 申请公布日期 1999.01.12
申请号 JP19970160758 申请日期 1997.06.18
申请人 STAR MICRONICS CO LTD 发明人 SONE TAKAHIRO;YAMADA HIROMI
分类号 H04R17/00;G10K9/122;H05K1/18;H05K3/34 主分类号 H04R17/00
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