| 摘要 |
PROBLEM TO BE SOLVED: To enable via filling to be formed efficiently through a simple operation by a method, wherein a non-electrolytic metallic film is formed into a via hole, and then metal electroplating is carried out through PR electrolysis. SOLUTION: Since metal concentration and current distribution are not uniform in a via hole which is small and deep, generally a current is lessened in density or agitation is intensified, so as to form an electroplating film uniform and superior in electrodeposition properties in the via hole. Metal, preferentially separated out at an opening, dissolved by inverting electrodes in polarity through a PR electrolysis, so that electroplating is carried out in such a state that excess metal ions are produced in concentration near a separating point in a via hole at all times, and a uniform film can be formed for the formation of a via-filling without regulating a current density or agitation. In this manner, a via filling is formed through a comparative simple means such as an electroplating method, so that via-filling method is very effective for the manufacture of various circuits. |
