发明名称 |
Wafer carrier with an anti-slip surface |
摘要 |
A wafer carrier having an anti-slip structure formed on outward surface portions of side plates of the wafer carrier. The anti-slip structure may be composed of at least one of several shapes or structures such as grooves, round shape projections, and acute angle shaped projections, each which is formed on both the outward surface portions. The wafer carrier having such an anti-slip structure prevents the wafer carrier from slipping or falling while the wafer carrier is being transported.
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申请公布号 |
US5857576(A) |
申请公布日期 |
1999.01.12 |
申请号 |
US19960757085 |
申请日期 |
1996.11.26 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, MOON-KWAN;PARK, DONG-MYUNG |
分类号 |
B65D85/86;H01L21/673;(IPC1-7):A47F7/00 |
主分类号 |
B65D85/86 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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