发明名称 Wafer carrier with an anti-slip surface
摘要 A wafer carrier having an anti-slip structure formed on outward surface portions of side plates of the wafer carrier. The anti-slip structure may be composed of at least one of several shapes or structures such as grooves, round shape projections, and acute angle shaped projections, each which is formed on both the outward surface portions. The wafer carrier having such an anti-slip structure prevents the wafer carrier from slipping or falling while the wafer carrier is being transported.
申请公布号 US5857576(A) 申请公布日期 1999.01.12
申请号 US19960757085 申请日期 1996.11.26
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, MOON-KWAN;PARK, DONG-MYUNG
分类号 B65D85/86;H01L21/673;(IPC1-7):A47F7/00 主分类号 B65D85/86
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