| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a thin film growing equipment with which the heat on the plane of a wafer can be equalized by a simple means. SOLUTION: A groove-like heat insulating part 8 is provided between the circumferential part, which comes in contact with a susceptor 2 on the backside of a wafer tray 60, and the circumferential part of a wafer placing part 5, and when the wafer tray 10 is housed in the susceptor 2, a gap is formed by the heat insulating part 8 between the susceptor 2 and the wafer tray 10. Accordingly, the dispersion of heat to the susceptor 2 from the circumferential part of the wafer placing part 5 can be suppressed, and the temperature of the wafer surface can also be maintained uniformly.</p> |
