| 摘要 |
PROBLEM TO BE SOLVED: To stop bonding operation without generating a defective island part by stopping the application operation of an adhesive, then completing the bonding of a semiconductor pellet to all the bonding parts where the adhesive has been already applied before the stop, and then stopping the bonding operation. SOLUTION: A semiconductor pellet bonding device 10 is constituted of a carrying means 11 of a lead frame 1, an application means 12 of a paste 2, a bonding means 13 of a semiconductor pellet (pellet) 3, and these control devices. When a bonding operation is to be stopped, the operation of the application means 12 is first stopped, then the pellet 3 is bonded to all the island parts where the paste 2 is applied, until being located between an application position A and a bonding position B. Then the bonding operation is stopped, thus leaving and curing the paste 2 being applied onto the island part, without bonding the pellet 3 and preventing a faulty island part from being generated.
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