发明名称 Temperature controlling cryogenic package system
摘要 A temperature controlled cryogenic package system for efficiently and precisely monitoring and controlling the operating temperature of a high temperature superconductor circuit placed on a substrate. The cryogenic package system comprises a heating element formed on the same substrate as the high temperature superconductor circuit, a control circuit capable of activating and deactivating the heating element, and a temperature sensor placed in thermal proximity to the high temperature superconductor circuit. The temperature sensor monitors the operating temperature of the high temperature superconductor circuit, and conveys temperature information to the control circuit. The control circuit activates or deactivates the heating element according to the warming or cooling effect that is necessary in order to maintain the high temperature superconductor circuit within a predetermined temperature range, where the range of temperature fluctuation is within plus or minus 0.1 K of a predetermined temperature.
申请公布号 US5857342(A) 申请公布日期 1999.01.12
申请号 US19980021683 申请日期 1998.02.10
申请人 SUPERCONDUCTOR TECHNOLOGIES, INC. 发明人 ROHLFING, STEPHAN M.;FORSE, ROGER J.;SCHAREN, MICHAEL J.;KUNIMOTO, WALLACE
分类号 F17C3/08;G05D23/19;H01L21/00;(IPC1-7):F25B19/00 主分类号 F17C3/08
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