发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To prevent adhesion force between a pad electrode and an interlayer insulation film from decreasing by providing irregularities, so that the interface between the pad electrode and the interlayer insulation film is not a flat surface. SOLUTION: A pad 3a is formed on an insulation film 2, an opening 8 formed into a matrix is formed on the interlayer insulation film 2 which is formed on the pad 3a, and a metal layer 9 is formed at a height lower than that of the interlayer insulation film 2 inside the opening. Irregularities are formed by the interlayer film surface and a metal layer 9 being formed in the opening 8, and further a pad electrode 3b and a passivation film 4 are formed on the upper portion of the irregularities, thus enabling an ultrasonic vibration being applied to a capillary for contributing to the deformation of the both between a gold ball and a pad electrode 3b. At the same time, they are transferred also to an area between the lower-layer pad electrode 3b and the interlayer insulation film 2. However, since the interface is not on a single flat surface due to the irregularities, sliding is prevented.
申请公布号 JPH118264(A) 申请公布日期 1999.01.12
申请号 JP19970156985 申请日期 1997.06.13
申请人 NEC CORP 发明人 KIKKAI AKIRA;HOTTA HIROFUMI
分类号 H01L23/52;H01L21/3205;H01L21/321;H01L21/60 主分类号 H01L23/52
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