发明名称 SIGNAL ATTENUATOR FOR DIELECTRIC WAVEGUIDE
摘要 PROBLEM TO BE SOLVED: To provide a signal attenuator which can be utilized as the transmission line of a multilayered substrate or semiconductor package and utilized for the transmission line of a dielectric waveguide type to be prepared, while using lamination techniques. SOLUTION: This device is composed of a dielectric waveguide 20 formed inside a substrate 10 by laminating dielectric layers 11 and either plural via hole conductors 23 for attenuation consisting of a high resistance metal formed inside this dielectric waveguide 20 or any one kind of plural conductor patterns for attenuation. In this case, it is preferable that the side face of the dielectric waveguide 20 be formed at least from two rows of via hole conductor 14 groups formed in the signal transmission direction at intervals less than a 1/2 transmission signal wavelength formed inside the substrate 10.
申请公布号 JPH118502(A) 申请公布日期 1999.01.12
申请号 JP19970158487 申请日期 1997.06.16
申请人 KYOCERA CORP 发明人 UCHIMURA HIROSHI;TAKENOSHITA TAKESHI;FUJII MIKIO
分类号 H01P1/22;H01P1/26;H01P3/12 主分类号 H01P1/22
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