发明名称 POSITIVE PHOTORESIST COMPOSITION AND MULTILAYER RESIST MATERIAL USING THE SAME
摘要 PROBLEM TO BE SOLVED: To enhance a film enduring rate at the time of forming a lone pattern, development contrast on exposed areas and non-exposed areas, resolution, exposure latitude, and sectional forms, and to enable it to form a good resist pattern by incorporating an alkali-soluble resin and a specified compound having a hydroxyl group esterified by a quinonediazidosulfonic acid. SOLUTION: This positive photoresist composition comprises the alkali-soluble resin, and the compound having a part or all the hydroxyl groups to be esterified with the quinonediazidosulfonic acid, and this compound is represented by the formula in which each of R<1> and R<2> is, independently, an 1-5C alkyl group; and (a) is 0 or 1. This quinonediazido compound of the formula is superior in an effect of restraining a pattern thinning phenomenon due to defocusing on the negative side of the focus even by the BARC method.
申请公布号 JPH117128(A) 申请公布日期 1999.01.12
申请号 JP19970161473 申请日期 1997.06.18
申请人 TOKYO OHKA KOGYO CO LTD 发明人 DOI KOSUKE;TAMURA SACHIKO;OBARA HIDEKATSU;NAKAYAMA TOSHIMASA
分类号 G03F7/004;G03F7/022;G03F7/11;G03F7/26;H01L21/027;(IPC1-7):G03F7/022 主分类号 G03F7/004
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