发明名称 |
Semiconductor device having tab tape lead frame with reinforced outer leads |
摘要 |
In a lead frame adapted to be used for a semiconductor device, a plurality of inner leads are made of a thin conductive material for easily forming a fine pattern of the inner leads. A plurality of outer leads are integrally formed with the respective inner leads. The outer leads are coated with metal layers to increase the thickness thereof, so that a desired strength of the outer leads is obtained. A semiconductor chip is electrically connected to the inner leads. The semiconductor chip and a part of the lead frame including the inner leads are hermetically sealed with a resin and, thus, a semiconductor device is obtained.
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申请公布号 |
US5859471(A) |
申请公布日期 |
1999.01.12 |
申请号 |
US19970948029 |
申请日期 |
1997.10.09 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
KURAISHI, FUMIO;YUMOTO, KAZUHITO;HAYASHI, MAMORU |
分类号 |
H01L23/24;H01L23/433;H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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