| 摘要 |
PROBLEM TO BE SOLVED: To largely reduce a manufacturing cost and to stabilize a resistance value distribution and size, by extrusion molding semiconductive resin containing conductive filler and resin on a metal shaft, thereby simplifying the step of forming a semiconductive layer. SOLUTION: Melted semiconductive thermoplastic elastomer is sent to a crosshead die 2 by an extruder. Then, melted resin 1 introduced into the crosshead is passed through a gap 6 between a die 4 and a nipple 5 via a manifold 3, and extruded out of the crosshead. And, a metal shaft 7 is supplied to a center of the crosshead by a mandrel pushing unit such as a caterpillar die, and covered with semiconductive thermoplastic elastomer melted and extruded thereon. Thus, steps of vulcanizing and crosslinking are eliminated to simplify manufacturing steps. Then, a manufacturing cost can be decreased, and resistance value distribution and size can be stabilized. |
