发明名称 TAPE WITH ADHESIVE, METAL-CLAD LAMINATE, AND CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To obtain a tape with adhesive that facilitates positioning, by forming an adhesive layer on at least one side of an arom. polyimide film having a good dimensional stability, a thickness in a specified range, and a specified absorptivity coefficient or lower at specified wavelengths. SOLUTION: The sheet with adhesive is prepd. by forming an adhesive layer on at least one side of an arom. polyimide film which has a good dimensional stability, a thickness of 10-200μm, and an absorptivity coefficient of 15.0×10<-3> /μm or lower at a wavelength of 500 nm and 5.0×10<-3> /μm or lower at a wavelength of 600 nm and pref. has a thermal expansion coefficient of 0.5×10<-5> -2.5×10<-5> / deg.C or lower at a temp. of 50-200 deg.C, a water absorption of 2.5% or lower, and a tensile modulus of 450 kg/mm<2> or higher. The polyimide film, as it is or after subjected to a surface treatment (e.g. corona discharge), is coated with an adhesive selected from among polyimide adhesives, polyimidosiloxane-epoxy adhesives, etc., to form an adhesive layer with a thickness of 3-30μm and then laminated to a metal foil (e.g. a copper foil) with a thickness of 8-50μm to give a metal-clad laminate.
申请公布号 JPH115954(A) 申请公布日期 1999.01.12
申请号 JP19970159679 申请日期 1997.06.17
申请人 UBE IND LTD 发明人 INOUE HIROSHI;TAKAHASHI TAKUJI;TAKABAYASHI SEIICHIRO;YAMAMOTO TOMOHIKO;HOSOMA TOSHINORI
分类号 C08J7/00;B32B7/10;B32B15/088;B32B27/34;C09J7/02;C09J179/08;C23C14/20;H05K1/03;H05K3/38;(IPC1-7):C09J7/02;B32B15/08 主分类号 C08J7/00
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