发明名称 |
Siloxane polymide and heat-resistant adhesive containing the same |
摘要 |
A solvent-soluble siloxane polyimide comprising a copolymer obtained by reaction of a diamine compound mixture comprising a diaminopolysiloxane and an alicyclic diamine with an aromatic tetracarboxylic acid anhydride, followed by polyimidization reaction of the resulting polyamic acid forms a heat-resistant adhesive by adding an epoxy resin, a diamine-based curing agent and an organic solvent thereto, The formed adhesives show a distinguished heat-resistant adhesiveness when the resulting siloxane polyimide soluble in ordinary organic solvents is used as a main component of the adhesive for bonding between a base material and a copper foil of a flexible printed substrate. By further addition of a fluorinated resin to the heat-resistant adhesive, the adhesiveness can be more improved.
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申请公布号 |
US5859181(A) |
申请公布日期 |
1999.01.12 |
申请号 |
US19970992774 |
申请日期 |
1997.12.17 |
申请人 |
NIPPON MEKTRON, LIMITED |
发明人 |
ZHAO, DONG;SAKUYAMA, HIROSHI;KATONO, TOMOKO;CHIANG, LIN-CHIU;LIN, JENG-TAIN |
分类号 |
C08L63/00;C08G59/50;C08G73/10;C08G77/455;C08L79/08;C08L83/10;C09J163/00;C09J179/08;C09J183/10;H05K1/00;H05K3/38;(IPC1-7):C08G73/10;C08G69/26 |
主分类号 |
C08L63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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