发明名称 ROM device having memory units arranged in three dimensions, and a method of making the same
摘要 A three-dimensional ROM device includes a silicon substrate having plurality of parallel trenches formed in an upper surface thereof, and a plurality of raised mesa regions. Each trench has a bottom and a pair of sidewalls, and is separated from an adjacent trench by a respective mesa region. A plurality of separated, parallel source/drain regions are provided, including a first and second source/drain region located on respective opposite sides of a respective trench bottom, and a third and fourth source/drain region located on respective opposite sides of a respective raised mesa region. Each source/drain region serves as a bit line. A gate oxide layer is located on the upper surface of the silicon substrate. A plurality of sidewall oxide layers are formed on selected sidewalls and serve as channel barriers. A plurality of silicon nitride layers are formed above selected mesa regions and trench bottoms, and serve as channel barriers. A plurality of gate layers are located over the gate oxide layer and the silicon nitride layers and serve as word lines. A region between any two adjacent source/drain regions comprises a channel region.
申请公布号 US5858841(A) 申请公布日期 1999.01.12
申请号 US19970977535 申请日期 1997.11.25
申请人 UNITED MICROELECTRONICS CORPORATION 发明人 HSU, CHEN-CHUNG
分类号 H01L21/8246;H01L27/112;(IPC1-7):H01L21/824 主分类号 H01L21/8246
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