Method of treating a semi-conductor wafer

摘要

PCT No. PCT/GB95/01057 Sec. 371 Date Jan. 5, 1996 Sec. 102(e) Date Jan. 5, 1996 PCT Filed May 10, 1995 PCT Pub. No. WO95/31823 PCT Pub. Date Nov. 23, 1995In a method of treating a semi-conductor wafer a short-chain polymer is deposited on the wafer to planarise surface features on the wafer and a diffusion layer is deposited on the surface of the polymer layer to allow moisture to be released from the polymer at a controlled rate.