| 摘要 |
FIELD: computer engineering, in particular, for chip cards. SUBSTANCE: device, which is designed, in particular, for mounting inside chip card, has semiconductor chip which is located on conducting substrate and is connected to its contact pins. Semiconductor chip and its wire terminals for connection of contact pins are enveloped by plastic so that contact pins are projected from plastic as conductors for connection to semiconductor chip. Contact pins provide contact plates on one of plastic surfaces. In addition at least two contact pins provide terminals for antenna coil terminals at continuation of contact plates. EFFECT: possibility for testing without antenna coil, possibility to mount coil on carrying frame. 7 cl, 3 dwg |
