System for manufacturing multichip module

摘要

After bonding the chips (2) are covered. Then a liq. epoxy resin is filled in the spaces (b) between the chips and a line-forming mass is applied longitudinally between the lines. After closing the mass applicator valves, the applicator is moved back to the module starting point. Then a first ring (3) is laid round the outer periphery of the chip region, and a second one applied at a defined spacing. Next embedding mass is applied in a meander from the outer edge of the module narrow side in the direction of the opposite outer edge. Pref. after epoxy resin application it is shortly hardened.