发明名称 |
Hermetic thin pack semiconductor device |
摘要 |
<p>A hermetic thin pack semiconductor device has a semiconductor substrate and at least one electrode on the upper surface of the semiconductor substrate. A lid of a ceramic material for the semiconductor device has at least one opening extending through the lid. A first electrically conductive material is located on the interior surface of the at least one opening, a second electrically conductive material is located on at least a portion of the upper surface of the lid, and a third electrically conductive material is located on at least a portion of the lower surface of the lid. A solder material is positioned between the electrode and the third electrically conductive material and positioned on a corresponding portion of the electrode opposite a corresponding opening in the lid. <IMAGE></p> |
申请公布号 |
EP0889523(A2) |
申请公布日期 |
1999.01.07 |
申请号 |
EP19980401586 |
申请日期 |
1998.06.25 |
申请人 |
HARRIS CORPORATION |
发明人 |
AZOTEA, JAMES;TEMPLE, VICTOR A.K. |
分类号 |
H01L23/04;H01L23/10;(IPC1-7):H01L23/10 |
主分类号 |
H01L23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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