Conductive material application to and-or removal from circuit board

摘要

A process for removing electrically conductive material (KU) from a circuit board (PL), bearing an etch mask which covers a conductor structure, involves placing the circuit board (PL) together with an electrode (ELC) in an electrolyte liquid (E) and applying voltages (+U, U) with different potentials to the circuit board and the electrode. Also claimed are (a) a process for applying electrically conductive material (KU) onto a circuit board (PL), on which a conductor structure is reproduced, by placing a brush (B) and an electrode (ELC) in an electrolyte liquid (E), applying voltages with different potentials to the brush and the electrode and moving the circuit board below and in direct contact with the brush; and (b) a conductive material application and removal process comprising carrying out process (a) to form a thin conductive layer on the circuit board, removing the brush, depositing a thick conductive layer at regions not covered by an etch mask and repeating process ( a) to remove a thin conductive layer from the circuit board. Further claimed are (i) circuit boards treated by the above processes; and (ii) apparatus for carrying out the above processes.