| 摘要 |
<p>A planar, capacitive-type, rectangular, and multi-pixel fingerprint sensing array is mounted on the horizontal and generally rectangular top-surface of a dome that extends upward generally from the center of a horizontally disposed and generally rectangular silicon substrate member. The dome is formed by four upward extending and inclined, or tapered, side wall surfaces, at least one wall surface of which carries electrical circuit paths that electrically connected to the various circuit elements of the sensing array. A generally rectangular, encircling and wall-like card carrier assembly includes a generally horizontal upper-surface having a generally centered opening through which only the dome and sensing array project upward. The bottom-surface of the card carrier assembly is mounted to edge portions of the silicon substrate member in a manner to surround and protect all but the upward extending dome. A flexible membrane or laminate is sealed to the top-surface of the card carrier assembly to form a flexible surface over the sensing array. The card carrier assembly includes circuit path having an external portion and having an internal portion that connects to the wall-mounted internal electrical circuit paths, the external portion providing external connection to the internal sensing array. <IMAGE></p> |
