摘要 |
<p>A method for producing an electronic part employed in a multilayer ceramic part, in which the conventional step of grinding the multilayer sintered block for the connection of the inner electrodes of the electronic part to the outer electrodes is omitted and by which the electrical connection to the outer electrodes is enhanced even though the inner electrodes are thinner than conventional. When a multilayer body is baked, swelling conductor parts are formed on exposed ends of the inner electrodes (12) provided in the body by vapor deposition of a conductive material different from that of the inner electrodes (12). Therefore, the connection of the inner electrodes (12) to the outer electrodes (14) is facilitated because of the swelling conductor parts (13).</p> |