发明名称 Verfahren zum Weichlöten von Metallen und Weichlot zur Ausführung dieses Verfahrens
摘要 The invention relates a method for soft soldering metals onto a soldering joint, wherein a soft solder liquefied as a result of heating is brought into contact with the metal components to be joined on the solder joint and then cooled to produce a solid soldered joint. The invention is characterized in that at least one reaction component is provided on the soldering joint and reacts exothermally with at least one other component by heating it to a melting temperature so that the local temperature in the soldering joint rises to a solder-melting temperature.
申请公布号 DE19728014(A1) 申请公布日期 1999.01.07
申请号 DE19971028014 申请日期 1997.07.01
申请人 ZENTRUM FUER MATERIAL- UND UMWELTTECHNIK GMBH, 09599 FREIBERG, DE;BG METALLWERK GOSLAR GMBH & CO. KG, 38640 GOSLAR, DE;FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG EV, 80636 MUENCHEN, DE 发明人 ALBRECHT, HANS-JUERGEN, 13053 BERLIN, DE;DOERR, MICHAEL, 38640 GOSLAR, DE;HAERTEL, WOLFGANG, 09599 FREIBERG, DE;SCHEEL, WOLFGANG, 10178 BERLIN, DE;BEREK, HARRY, 09600 OBERSCHOENA, DE;HANNEMANN, MONIKA, 12587 BERLIN, DE;PACHSCHWOELL, HEINO, 34477 TWISTETAL, DE;WITTKE, KLAUS, 12165 BERLIN, DE
分类号 B23K1/00;B23K35/26;B23K35/34;H05K3/34;(IPC1-7):B23K1/00 主分类号 B23K1/00
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