| 摘要 |
<p>PROBLEM TO BE SOLVED: To enhance the molding accuracy of the inner lead of a lead frame, by a method wherein the lead frame is subjected to bending work downwards excluding the planar part of the bonding area of the inner lead, and the outer lead of the lead frame is made to lead out from the bottom of a package. SOLUTION: A semiconductor device is constituted into a structure, wherein, with a semiconductor chip 1 fixed by adhesion on a die pad 3 via a silver paste 2, an electrode part 1a of the chip 1 and an inner lead 4a of a lead frame 4 are connected with each other through a gold wire 5, and thereafter, the device is formed into the structure of a resin-sealed package 6 excluding the part to be used as an outer lead 4b of the lead frame 4. Then with the lead frame 4 subjected to bending work on its lower side at roughly a right angle leaving the flat part 4d of the bonding area of the inner lead 4a, the lead 4b is led out from the bottom 6a of the package 6 and is provided in parallel to the bottom 6a along the bottom 6a. As a result, the reliability in mounting the chip 1 on a substrate can be enhanced.</p> |
