| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a module which is advantageous in terms of strength and cost and which is easily operated. SOLUTION: A contact probe 40 which contact-presses the electrode of a semiconductor chip 38 is fixed to a probe holder 49. A pressure contact force is applied by screws 51. A heat sink 31 is constituted of a composite material of ceramics and metal. A metal layer (aluminum and the like) 34a is formed on the surface of the heat sink 31. Since metal supports (aluminum and the like) 34b are formed integrally with the metal layer 34a, they are integrated with the heat sink 31. The metal support 34b play a role for supporting pressure contact force which is added to the electrode of the semiconductor chip 38.</p> |
