| 摘要 |
PROBLEM TO BE SOLVED: To reduce the number of component parts and the number of assembling processes by a method wherein an aperture part is provided on a semiconductor chip, a non-conductive resin molded body is covered, and a conductive resin molded body, which is electrically connected to an earth pin, is provided. SOLUTION: After a semiconductor receiving chip 1 and each lead of a lead frame 3 have been wire-bonded, they are molded and sealed by a transparent non-conductive resin molded body. Subsequently, almost the entire body of the non-conductive resin molded body 4 is covered while it is being conducted by connecting it to an earth pin 8, and an aperture part is provided to pass through the signal to the semiconductor receiving chip 1. Also, a conductive resin molded body 7 is formed in such a manner that it does not come in contact with the lead other than the earth pin 8. Accordingly, as a metal case is unnecessitated, the number of component parts and the number of processes of assembling can be cut down. Also, as the conductive resin molded body 7 is integrally formed on the non-conductive resin molded body 4, the semiconductor receiving set can, be made small in size and space saving can be accomplished.
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