| 摘要 |
In a polishing machine so configured that a surface to be polished of a wafer is brought into a sliding contact with a polishing pad spread over a rotating surface plate, while supplying a polishing liquid onto the polishing pad, for the purpose of polishing the surface to be polished of the wafer, the polishing pad includes a lower polishing web formed of a relatively soft material and spread on a surface of the rotating surface plate, and an upper polishing web formed of a relatively hard material and larger than the lower polishing web. The upper polishing web is laid on the lower polishing web with a double-adhesive-coated waterproof tape being interposed between the upper polishing web and the lower polishing web, so that a peripheral portion of the upper polishing web is bonded to a peripheral portion of the rotating surface plate with only the waterproof tape being interposed between the rotating surface plate and the peripheral portion of the upper polishing web. Thus, the lower polishing web is completely watertightly enclosed with the upper polishing web and the rotating surface plate, so that water included in the polishing liquid is prevented from immersing into the lower polishing web. |
