| 摘要 |
PROBLEM TO BE SOLVED: To prevent fine cracks from occurring in the surface opening of a through-hole provided to a ceramic board keeping the ceramic board high in dimensional accuracy by a method wherein the ceramic board is set non-uniform in thickness throughout its surface, and only a part of the board located apart from its periphery by an optional distance is set small in thickness. SOLUTION: In a method where a pressure is applied only onto a part of a ceramic board, the pressed part of the ceramic board is more sintered and densified so as to become higher in density than the rest of the ceramic board. Resultantly, in a ceramic electronic circuit board 1, the pressed parts are turned to recesses 1a and 1b, so that the ceramic electronic circuit board 1 becomes non-uniform in thickness. The recesses 1a and 1b or the pressed parts are present at a part of the ceramic board 1, or it is no problem that the recesses 1a and 1b are located apart from the periphery of the ceramic board by an optional distance. It is also no problem that the recess 1a is located only on the surface of the ceramic board 1 or the recesses 1a and 1b are located on the front and rear surface of the ceramic board 1 respectively. |
