CONDUCTIVE COPPER PASTE COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a highly conductive copper paste composition whose copper powders are brought into wide contact with one another. SOLUTION: A conductive copper paste composition comprises a dendritic copper powder and a binder resin as the essential components, and has the properties of BET specific surface areas of 3900 to 6300 cm<2> /g and hydrogen reduction losses of 1% or less. The binder resin is preferably blended with the copper powder by 10 to 40 wt.% to the powder.