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发明名称
HIGH GRADE GOLD SOLDER MATERIAL
摘要
申请公布号
JPH11792(A)
申请公布日期
1999.01.06
申请号
JP19970152725
申请日期
1997.06.11
申请人
SUMITOMO METAL MINING CO LTD
发明人
OBARA TAKESHI;YOKOZAWA KOICHI;OSAKO TOSHIYUKI
分类号
B23K35/30;C22C5/02;(IPC1-7):B23K35/30
主分类号
B23K35/30
代理机构
代理人
主权项
地址
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