| 摘要 |
PROBLEM TO BE SOLVED: To provide a module which is advantageous in terms of strength and cost and which is superior in moisture proof property. SOLUTION: MMCs(Al-SiC)31b are formed at the edges of a heat sink 31a constituted of the composite material of ceramics and aluminum. Metallic layers (aluminum) 34a and 34b are formed on the surfaces of the heat sink 31a and MMC31b, and flanges 43b which are integrally formed with the metallic layers 34a and 34b are formed. The flanges 43b are arranged so that they surround semiconductor chips 35. Housings 42 are connected to the flanges 43b, and spaces where the semiconductor chips 35 exist become airtight state. The space is covered by a resin 49. The flanges 43b also play roles for supporting a press- contact force on the semiconductor chips. |
