发明名称 |
Power distribution system for semiconductor die |
摘要 |
<p>A power distribution system for a semiconductor die includes bonding pads located adjacent to and connected to power busses with connections between the bonding pads providing a parallel path for current. Connections may be provided by stitch bonds, by conductors within a substrate or by other means. <IMAGE></p> |
申请公布号 |
EP0887800(A2) |
申请公布日期 |
1998.12.30 |
申请号 |
EP19980304978 |
申请日期 |
1998.06.24 |
申请人 |
HONEYWELL INC. |
发明人 |
NGUYEN, TOAN D.;JOHNSON, MICHAEL T. |
分类号 |
G11C5/14;(IPC1-7):G11C5/14 |
主分类号 |
G11C5/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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