发明名称 LASER CUTTING METHOD AND LASER CUTTER
摘要 <p>A laser cutting method and a laser cutter which meet the demand for preventing adverse effects by self burning or the like on cutting surfaces particularly during high-speed cutting. A laser cutting method in which a cutting laser beam (22) is applied to a material (25) to be cut at a cutting point (26) while ejecting gas streams (23, 24) against the cutting point (26) or its surrounding area from a plurality of nozzles (30, 31) arranged in a ring or in line, wherein the oxygen concentration of the gas streams (23, 24) flowing out of at least one of the nozzles (30, 31) is changed to adjust the oxygen concentration distribution in an area within several millimeters of the cutting point (26). This method and the laser cutter can limit the adverse effects by self burning or the like and improve the cutting quality.</p>
申请公布号 WO9858760(A1) 申请公布日期 1998.12.30
申请号 WO1998JP02763 申请日期 1998.06.22
申请人 TANAKA ENGINEERING WORKS, LTD.;NAGATA, YOZO;NAGAHORI, MASAYUKI 发明人 NAGATA, YOZO;NAGAHORI, MASAYUKI
分类号 B23K26/06;B23K26/12;B23K26/14;(IPC1-7):B23K26/00 主分类号 B23K26/06
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