| 摘要 |
PCT No. PCT/JP96/01919 Sec. 371 Date Feb. 26, 1996 Sec. 102(e) Date Feb. 26, 1996 PCT Filed Jul. 10, 1996 PCT Pub. No. WO97/03129 PCT Pub. Date Jan. 30, 1997An epoxy resin composition composed of an epoxy resin (A), a hardener (B), and an inorganic filler (C), characterized in that the content of the inorganic filler (C) is 70-97 wt % and the inorganic filler (C) contains 0.1-50 wt % of alumina. When used to seal semiconductor devices, it exhibits good moldability and imparts to the sealed semiconductors good flame retardance, solder heat resistance, and reliability at high temperatures.
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