发明名称 Ultrasonic phased array transducer with an ultralow impedance backfill and a method for making
摘要 The present invention discloses an ultrasonic phased array transducer with an ultralow backfill and a method for making. The ultrasonic phased array includes a low density backfill material having an ultralow acoustic impedance. The backfill material is either an aerogel, a carbon aerogel, an xerogel, or a carbon xerogel. A piezoelectric ceramic material and two matching layers are bonded to the backfill material. In one embodiment, a plurality of interconnect vias are formed in the backfill material with conducting material deposited in the vias. A portion of the bonded matching layers, the piezoelectric ceramic material, and the backfill material have isolation cuts therethrough to form an array of electrically and acoustically isolated individual elements. In a second embodiment, the backfill material is bonded to an electronic layer at a face opposite to the piezoelectric ceramic material and the matching layers. Then isolation cuts are made through the matching layers, the piezoelectric ceramic material, and the backfill material, to form an array of electrically and acoustically isolated individual elements.
申请公布号 US5852860(A) 申请公布日期 1998.12.29
申请号 US19970786812 申请日期 1997.01.21
申请人 GENERAL ELECTRIC COMPANY 发明人 LORRAINE, PETER WILLIAM;SMITH, LOWELL SCOTT
分类号 B06B1/06;G10K11/00;(IPC1-7):H01L41/22;A61B8/00 主分类号 B06B1/06
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