发明名称 |
Long fin omni-directional heat sink |
摘要 |
A heat sink adapted to dissipate heat from an electronic component wherein a plurality of heat dissipating perforated fins project generally outwardly from a planar base and are spaced apart by channels therebetween. The height of the perforated fins to the width of the channels is at least about 8 to 1. The perforations through the fins are such that the flow of cooling fluid through the fins generally emulates the flow through a comparable pin grid array heat sink. The fin structure is such that the fin is structurally supported against deformation, particularly during cross-cutting operations.
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申请公布号 |
US5854739(A) |
申请公布日期 |
1998.12.29 |
申请号 |
US19960602487 |
申请日期 |
1996.02.20 |
申请人 |
INTERNATIONAL ELECTRONIC RESEARCH CORP. |
发明人 |
STEINER, RONALD E.;CHOW, PETER S. |
分类号 |
H01L23/473;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/473 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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