发明名称 Long fin omni-directional heat sink
摘要 A heat sink adapted to dissipate heat from an electronic component wherein a plurality of heat dissipating perforated fins project generally outwardly from a planar base and are spaced apart by channels therebetween. The height of the perforated fins to the width of the channels is at least about 8 to 1. The perforations through the fins are such that the flow of cooling fluid through the fins generally emulates the flow through a comparable pin grid array heat sink. The fin structure is such that the fin is structurally supported against deformation, particularly during cross-cutting operations.
申请公布号 US5854739(A) 申请公布日期 1998.12.29
申请号 US19960602487 申请日期 1996.02.20
申请人 INTERNATIONAL ELECTRONIC RESEARCH CORP. 发明人 STEINER, RONALD E.;CHOW, PETER S.
分类号 H01L23/473;H05K7/20;(IPC1-7):H05K7/20 主分类号 H01L23/473
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