发明名称 Thermoplastic molding compound
摘要 PCT No. PCT/EP95/02072 Sec. 371 Date Dec. 16, 1996 Sec. 102(e) Date Dec. 16, 1996 PCT Filed May 31, 1995 PCT Pub. No. WO95/34586 PCT Pub. Date Dec. 21, 1995Thermoplastic molding compounds comprise as essential components A) from 10 to 100% by weight of copolymers of the monomers of the general formulae I and II <IMAGE> I <IMAGE> II where R1 is H or alkyl of 1-22 carbon atoms, R2 is H or alkyl of 1-22 carbon atoms, R3 is H or alkyl of 1-4 carbon atoms, a is 0, 1, 2, 3, 4 or 5, and b is 0, 1, 2, 3, 4 or 5, B) from 0 to 3000 ppm, based on the weight of component A, of compounds of the general formula I, C) from 0 to 500 ppm, based on the weight of component A, of compounds of the general formula II, D) from 0 to 90% by weight, based on the total weight of the molding compound, of polymers other than A), and E) from 0 to 50% by weight, based on the total weight of the molding compound, of additives and processing aids.
申请公布号 US5854353(A) 申请公布日期 1998.12.29
申请号 US19960750635 申请日期 1996.12.16
申请人 BASF AKTIENGESELLSCHAFT 发明人 KNOLL, KONRAD;GAUSEPOHL, HERMANN
分类号 C08L25/04;C08F2/00;C08F212/08;C08F212/32;C08F297/00;C08F297/02;C08L25/16;(IPC1-7):C08F293/00 主分类号 C08L25/04
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