发明名称 Method for forming capacitor of semiconductor device
摘要 A method for forming a capacitor of a semiconductor device, by which a three dimensional structure of a storage electrode occupying small space but having a great surface area is formed between word lines or bit lines. According to the method, an additional planarization layer is not formed on the word lines or the bit lines, so as to make the three dimensional structure high. Thus, the storage electrode comes to have an enlarged surface area enough to allow the formation of a capacitor with a sufficient capacitance for the high integration of semiconductor devices and thus to improve the properties and the reliability of semiconductor devices.
申请公布号 US5854107(A) 申请公布日期 1998.12.29
申请号 US19970924843 申请日期 1997.09.05
申请人 HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. 发明人 PARK, CHEOL SOO;KIM, DAE YOUNG
分类号 H01L27/04;H01L21/822;H01L21/8242;H01L27/108;(IPC1-7):H01L21/824 主分类号 H01L27/04
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