发明名称 Method for exposing photoresist
摘要 A method for patterning a polysilicon layer includes creating a TiN layer above an amorphous silicon (a-Si) layer forming a TiN/a-Si stack. The TiN/a-Si stack is formed above the polysilicon layer. The TiN layer serves as an ARC to reduce overexposure of the photoresist used to pattern the polysilicon layer, while the a-Si layer prevents contamination of the layer below the polysilicon layer.
申请公布号 US5854132(A) 申请公布日期 1998.12.29
申请号 US19940346041 申请日期 1994.11.29
申请人 ADVANCED MICRO DEVICES, INC. 发明人 PRAMANICK, SHEKHAR;LUNING, SCOTT;FEWKES, JONATHON
分类号 G03F7/09;H01L21/027;H01L21/3213;(IPC1-7):H01L21/465 主分类号 G03F7/09
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