| 发明名称 |
Method for reducing metal contamination of silicon wafers during semiconductor manufacturing |
| 摘要 |
A complex building agent, such as EDTA is added in a predetermined concentration to the "SC 1" step of a "PIRANHA-RCA" cleaning sequence for reducing the metal contamination left on the surface of a silicon wafer after completion of this cleaning step.
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| 申请公布号 |
US5853491(A) |
申请公布日期 |
1998.12.29 |
| 申请号 |
US19970827150 |
申请日期 |
1997.03.27 |
| 申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
SCHULZ, PETER |
| 分类号 |
C11D7/60;H01L21/02;H01L21/304;H01L21/306;H01L21/3213;(IPC1-7):B08B3/04;C23F1/24;C23G1/02 |
主分类号 |
C11D7/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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