| 摘要 |
PURPOSE: To improve the productivity without enlarging a sealing equipment containing a sealing metal mold, by performing resin sealing in the state that a jig provided with cavities for sealing a semiconductor device with resin and a runner for making resin flow in the cavities is put between upper and down molds. CONSTITUTION: A lead frame 4 on which a semiconductor element 5a is mounted is arranged on a lower sealing metal mold 2. A jig 3 provided, no both sides, with a cavity 9c and a runner 8a for making resin flow in the cavity 9c is arranged on the lead frame 4a. A lead frame 4b on which a semiconductor element 5b is mounted is arranged on the jig 3. An upper sealing metal mold 1 provided with a cavity 9b corresponding to the cavity 9c of the jig 3 is set. After a resin tablet is loaded in a pot part 6, mold clamping is performed, and the resin tablet is pressed with a plunger 7 and fluidized. The resin is made to flow in the cavities 9a, 9b, 9c, via the runner 8a, and cured. |
