Method and apparatus for soldering

摘要

The method for soldering a base material includes the following steps: (a) production of a lead-free binary solder consisting essentially of tin and a metal constituent capable forming an eutectic alloy with tin; (b) melting of the binary solder in a non-oxidising medium; (c) distribution of on the base material in an atmosphere whose oxygen content is equal to or less than 2000 ppm. The claimed apparatus (1) includes a unit (5, 3) for producing a molten binary solder, an antioxidation device (9) for preventing oxidation of the molten binary solder (S), a solder distribution unit, and an oscillation unit (7) for supplying oscillation wave energy at frequencies from 15 kHz to 1 MHz to the basis material (17) in contact with the solder.