发明名称 Integrated imaging head
摘要 <p>An imaging assembly (39) that generates all power supply voltages necessary to perform imaging operations comprising: a semiconductor imager (25) electronically connected to a printed circuit substrate, the substrate having an unregulated power input; at least one power regulator contained upon the substrate; a plurality of clock signal level translators upon the substrate; a Mixed Signal Process (44) upon the substrate having an analog to digital converter and a digital interface with an input status, an output status and a plurality of control signals; and a mechanical enclosure assembly having the substrate placed therein with an optical assembly aligned with the imager such that the enclosure hermetically seals the imager. The clock translators provide for translation of vertical sync, horizontal sync and frame sync pulses. The imaging assembly further provides support electronics (40) for the CCD. The support electronics comprise at least one voltage source for the CCD and voltages which are powered by a dedicated SMPS system (46). The image assembly further comprises a fiducial reference to which the image sensor and a lens mount for the image sensor are is precisely aligned. An IR filter (32) attached to the lens mount. A lens mount with a lens mount thereon, at least 3mm from the imager. The image assembly has a plurality of clock signal level translators further comprises at least one differential high voltage clocks. &lt;IMAGE&gt;</p>
申请公布号 EP0886441(A2) 申请公布日期 1998.12.23
申请号 EP19980201875 申请日期 1998.06.05
申请人 EASTMAN KODAK COMPANY 发明人 BEAMAN, BRYAN A.;GERSTENBERGER, JULIE K.;ORLICKI, DAVID M.
分类号 H01L27/14;H04N1/028;H04N5/335;(IPC1-7):H04N5/335 主分类号 H01L27/14
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