| 摘要 |
<p>A resistance wiring board which can be reduced in height and has a high accuracy of resistance value and excellent overload characteristics. The wiring board is obtained by forming a stepped pattern between electrode patterns formed on a green sheet and baking the green sheet after filling up the recessed section formed of the stepped pattern with a resistance paste. In addition, the height of the wiring board can be reduced by making the levels of the surfaces of electrodes (1) and a resistor (3) equal to or lower than that of the surface of an insulating substrate (2) by polishing the surface of the wiring board for improving the accuracy of thickness of the resistor (3). In addition, since the green sheet containing 1.5-2.5 wt.% TiO2, 1.5-2.5 wt.% MnO, and 1.5-4.5 wt.% SiO2 is used as a board material and a Pd-Ag electrode paste containing 60 wt.% Pd is used as an electrode material, the board material and electrode paste can be baked collectively at the same time without sacrificing the balance of the coefficients of thermal conductivity of the material and the paste.</p> |
