A method and apparatus for accurately registering electronic chip bonding pads (22) with substrate leads (23). Images are developed of different portions of the interface between the electronic chip (16) and the substrate (20) by reflecting collimated, parallel light from the bottom of the chip through transparent areas (24) of the substrate. Image analysis of the composite, superimposed images from spaced positions containing the bonding pads and the leads provide a corrective positioning after which the electronic chip and substrate are brought into contact.
