发明名称 RAIN SENSOR WITH BONDED SENSOR CHIPS
摘要 The invention relates to a rain sensor, wherein the transmitter (7) and the receiver (8) are formed by chips bonded onto a printed circuit board (6). Advantageous embodiments of the invention relate to filtering of radiation guided to the receiver (8) of the sensor. The sensor is provided with a barrier (19) to suppress parasitic radiation.
申请公布号 WO9857830(A1) 申请公布日期 1998.12.23
申请号 WO1998EP03528 申请日期 1998.06.10
申请人 ITT MANUFACTURING ENTERPRISES, INC.;SCHMID, BERND;SCHULER, THOMAS 发明人 SCHMID, BERND;SCHULER, THOMAS
分类号 B60S1/08 主分类号 B60S1/08
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