Packaged semiconductor device having stress absorbing film

摘要

PURPOSE: To provide a technology, wherein reliability of a semiconductor device can be improved. CONSTITUTION: For a semiconductor device sealed up with a mold resin, an insulating tape 4 which electrically insulates an inner lead, comprising a common inner lead 3a2 and plural signal inner leads 3a1 from a semiconductor chip 1 is extruded by a slight amount above the common inner lead 3a2 and the signal inner lead 3a1 . An occurrence of crack on a sealing-up resin and occurrence of a void within a narrow space between the inner lead and the semiconductor chip are prevented, for improved reliability of a semiconductor device.