发明名称 |
Temporary semiconductor package having dense array external contacts |
摘要 |
A temporary package for a semiconductor die is provided. The temporary package has an outline and external contact configuration that are the same as a conventional plastic or ceramic semiconductor package. The temporary package can be used for burn-in testing of the die using standard equipment. The die can then be removed from the package and certified as a known good die. The package includes a base, an interconnect and a force applying mechanism. The package base includes external contacts formed in a dense array, such as a land grid array (LGA), a pin grid array (PGA), a bumped grid array (BGA) or a perimeter array. The package base can be formed of ceramic or plastic with internal conductive lines using a ceramic lamination process, a 3-D molding process or a Cerdip formation process. |
申请公布号 |
SG55189(A1) |
申请公布日期 |
1998.12.21 |
申请号 |
SG19960009289 |
申请日期 |
1996.04.18 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
HEMBREE, DAVID, R.;FARNWORTH, WARREN, M.;WOOD, ALAN, G.;AKRAM SALMAN |
分类号 |
G01R31/26;H01L21/66;H01L23/00;H01L23/50;(IPC1-7):H01L23/00 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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