发明名称 |
Zero current draw circuit for use during a bonding option |
摘要 |
A circuit that is coupled to a bonding pad of an integrated circuit structure for reducing the leakage current through the structure to approximately zero when a bonding option is selected. The current path through the integrated circuit structure is removed by turning off a circuit element upon application of a control signal from the integrated circuit structure. <IMAGE> |
申请公布号 |
EP0886380(A2) |
申请公布日期 |
1998.12.23 |
申请号 |
EP19970309890 |
申请日期 |
1997.12.08 |
申请人 |
ADVANCED MICRO DEVICES INC. |
发明人 |
AN, JIU |
分类号 |
H01L27/04;H01L21/60;H01L21/82;H01L21/822;H03K19/173 |
主分类号 |
H01L27/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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