| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which no crack can be generated from the edge part of an epoxy agent, and separation between epoxy adhesive and resin mold is not generated. SOLUTION: In a semiconductor device which is assembled by resin molding an IC chip 2 fixed to a lead frame with an epoxy system adhesive 3, and connected with metallic thin wires so that this IC chip can be covered, a half hole 10 larger than an IC chip, or a half hole smaller than the IC chip, or plural half holes are provided at the central part of the die pad of the lead frame. The epoxy adhesive is applied in the half hole, and then the IC chip 2 is fixed to the die pad. Also, the epoxy adhesive amount is discouragingly adjusted so as not to appear on the upper face of the die pad.
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